IC WIRE BOND INSPECTION USING ELLIPTICAL MODEL APPROXIMATION.
1850-1851
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Main Authors: | Ngan, King N., Kang, Sing B. |
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Other Authors: | ELECTRICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/72680 |
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Institution: | National University of Singapore |
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