Novel electrical performance analysis for leaded packages

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

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Bibliographic Details
Main Authors: Jin, Z., Ma, J., Iyer, M.K., Ooi, B.L., Leong, M.S.
Other Authors: INSTITUTE OF MICROELECTRONICS
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/72808
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Institution: National University of Singapore
Description
Summary:IEEE Topical Meeting on Electrical Performance of Electronic Packaging