Novel electrical performance analysis for leaded packages

Novel electrical performance analysis for leaded packages

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

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Bibliographic Details
Main Authors:	Jin, Z., Ma, J., Iyer, M.K., Ooi, B.L., Leong, M.S.
Other Authors:	INSTITUTE OF MICROELECTRONICS
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/72808
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Institution:	National University of Singapore

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