A dielectrophoretic chip packaged at wafer level
10.1007/s00542-006-0126-y
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2014
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sg-nus-scholar.10635-730172023-10-30T21:14:07Z A dielectrophoretic chip packaged at wafer level Iliescu, C. Tay, F.E.H. Xu, G. Yu, L.M. Samper, V. MECHANICAL ENGINEERING 10.1007/s00542-006-0126-y Microsystem Technologies 12 10-11 987-992 2014-06-19T05:30:13Z 2014-06-19T05:30:13Z 2006-09 Conference Paper Iliescu, C., Tay, F.E.H., Xu, G., Yu, L.M., Samper, V. (2006-09). A dielectrophoretic chip packaged at wafer level. Microsystem Technologies 12 (10-11) : 987-992. ScholarBank@NUS Repository. https://doi.org/10.1007/s00542-006-0126-y 09467076 http://scholarbank.nus.edu.sg/handle/10635/73017 000239960600016 Scopus |
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National University of Singapore |
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NUS Library |
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Asia |
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Singapore Singapore |
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NUS Library |
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ScholarBank@NUS |
| description |
10.1007/s00542-006-0126-y |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Iliescu, C. Tay, F.E.H. Xu, G. Yu, L.M. Samper, V. |
| format |
Conference or Workshop Item |
| author |
Iliescu, C. Tay, F.E.H. Xu, G. Yu, L.M. Samper, V. |
| spellingShingle |
Iliescu, C. Tay, F.E.H. Xu, G. Yu, L.M. Samper, V. A dielectrophoretic chip packaged at wafer level |
| author_sort |
Iliescu, C. |
| title |
A dielectrophoretic chip packaged at wafer level |
| title_short |
A dielectrophoretic chip packaged at wafer level |
| title_full |
A dielectrophoretic chip packaged at wafer level |
| title_fullStr |
A dielectrophoretic chip packaged at wafer level |
| title_full_unstemmed |
A dielectrophoretic chip packaged at wafer level |
| title_sort |
dielectrophoretic chip packaged at wafer level |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73017 |
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1781783268973084672 |