A dielectrophoretic chip packaged at wafer level

10.1007/s00542-006-0126-y

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Bibliographic Details
Main Authors:	Iliescu, C., Tay, F.E.H., Xu, G., Yu, L.M., Samper, V.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73017
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Institution:	National University of Singapore

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