A dielectrophoretic chip packaged at wafer level
10.1007/s00542-006-0126-y
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Main Authors: | Iliescu, C., Tay, F.E.H., Xu, G., Yu, L.M., Samper, V. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73017 |
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Institution: | National University of Singapore |
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