A dielectrophoretic chip packaged at wafer level

10.1007/s00542-006-0126-y

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Bibliographic Details
Main Authors: Iliescu, C., Tay, F.E.H., Xu, G., Yu, L.M., Samper, V.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73017
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Institution: National University of Singapore

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