A slim sector model for the analysis of solder joint reliability

A slim sector model for the analysis of solder joint reliability

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Saved in:
Bibliographic Details
Main Authors: Zhao, B., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73098
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
Description
Summary:Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Similar Items