A slim sector model for the analysis of solder joint reliability
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
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2014
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sg-nus-scholar.10635-730982015-01-12T07:36:33Z A slim sector model for the analysis of solder joint reliability Zhao, B. Tay, A.A.O. MECHANICAL ENGINEERING Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 522-525 2014-06-19T05:31:08Z 2014-06-19T05:31:08Z 2004 Conference Paper Zhao, B.,Tay, A.A.O. (2004). A slim sector model for the analysis of solder joint reliability. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 522-525. ScholarBank@NUS Repository. 0780388216 http://scholarbank.nus.edu.sg/handle/10635/73098 NOT_IN_WOS Scopus |
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Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 |
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MECHANICAL ENGINEERING |
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MECHANICAL ENGINEERING Zhao, B. Tay, A.A.O. |
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Conference or Workshop Item |
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Zhao, B. Tay, A.A.O. |
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Zhao, B. Tay, A.A.O. A slim sector model for the analysis of solder joint reliability |
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Zhao, B. |
title |
A slim sector model for the analysis of solder joint reliability |
title_short |
A slim sector model for the analysis of solder joint reliability |
title_full |
A slim sector model for the analysis of solder joint reliability |
title_fullStr |
A slim sector model for the analysis of solder joint reliability |
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A slim sector model for the analysis of solder joint reliability |
title_sort |
slim sector model for the analysis of solder joint reliability |
publishDate |
2014 |
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http://scholarbank.nus.edu.sg/handle/10635/73098 |
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1681087685712674816 |