A slim sector model for the analysis of solder joint reliability

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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Bibliographic Details
Main Authors: Zhao, B., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73098
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-730982015-01-12T07:36:33Z A slim sector model for the analysis of solder joint reliability Zhao, B. Tay, A.A.O. MECHANICAL ENGINEERING Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 522-525 2014-06-19T05:31:08Z 2014-06-19T05:31:08Z 2004 Conference Paper Zhao, B.,Tay, A.A.O. (2004). A slim sector model for the analysis of solder joint reliability. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 522-525. ScholarBank@NUS Repository. 0780388216 http://scholarbank.nus.edu.sg/handle/10635/73098 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Zhao, B.
Tay, A.A.O.
format Conference or Workshop Item
author Zhao, B.
Tay, A.A.O.
spellingShingle Zhao, B.
Tay, A.A.O.
A slim sector model for the analysis of solder joint reliability
author_sort Zhao, B.
title A slim sector model for the analysis of solder joint reliability
title_short A slim sector model for the analysis of solder joint reliability
title_full A slim sector model for the analysis of solder joint reliability
title_fullStr A slim sector model for the analysis of solder joint reliability
title_full_unstemmed A slim sector model for the analysis of solder joint reliability
title_sort slim sector model for the analysis of solder joint reliability
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/73098
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