A study of the effect of viscoelasticity on delamination in a plastic IC package undergoing leadfree solder reflow
10.1109/EPTC.2007.4469819
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2014
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sg-nus-scholar.10635-731022023-10-26T10:01:55Z A study of the effect of viscoelasticity on delamination in a plastic IC package undergoing leadfree solder reflow Guojun, H.H. Tay, A.A.O. Yongwei, Z. Chew, S. MECHANICAL ENGINEERING 10.1109/EPTC.2007.4469819 Proceedings of the Electronic Packaging Technology Conference, EPTC 686-692 2014-06-19T05:31:11Z 2014-06-19T05:31:11Z 2007 Conference Paper Guojun, H.H., Tay, A.A.O., Yongwei, Z., Chew, S. (2007). A study of the effect of viscoelasticity on delamination in a plastic IC package undergoing leadfree solder reflow. Proceedings of the Electronic Packaging Technology Conference, EPTC : 686-692. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2007.4469819 1424413249 http://scholarbank.nus.edu.sg/handle/10635/73102 000253874600124 Scopus |
| institution |
National University of Singapore |
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NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| description |
10.1109/EPTC.2007.4469819 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Guojun, H.H. Tay, A.A.O. Yongwei, Z. Chew, S. |
| format |
Conference or Workshop Item |
| author |
Guojun, H.H. Tay, A.A.O. Yongwei, Z. Chew, S. |
| spellingShingle |
Guojun, H.H. Tay, A.A.O. Yongwei, Z. Chew, S. A study of the effect of viscoelasticity on delamination in a plastic IC package undergoing leadfree solder reflow |
| author_sort |
Guojun, H.H. |
| title |
A study of the effect of viscoelasticity on delamination in a plastic IC package undergoing leadfree solder reflow |
| title_short |
A study of the effect of viscoelasticity on delamination in a plastic IC package undergoing leadfree solder reflow |
| title_full |
A study of the effect of viscoelasticity on delamination in a plastic IC package undergoing leadfree solder reflow |
| title_fullStr |
A study of the effect of viscoelasticity on delamination in a plastic IC package undergoing leadfree solder reflow |
| title_full_unstemmed |
A study of the effect of viscoelasticity on delamination in a plastic IC package undergoing leadfree solder reflow |
| title_sort |
study of the effect of viscoelasticity on delamination in a plastic ic package undergoing leadfree solder reflow |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73102 |
| _version_ |
1781783278317993984 |