A study of the effect of viscoelasticity on delamination in a plastic IC package undergoing leadfree solder reflow

• Main Authors: Guojun, H.H., Tay, A.A.O., Yongwei, Z., Chew, S.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73102
• Institution: National University of Singapore

10.1109/EPTC.2007.4469819