Analytical solutions for interconnect stress in board level drop impact
10.1109/ECTC.2006.1645905
Saved in:
| Main Authors: | , , , , |
|---|---|
| Other Authors: | |
| Format: | Conference or Workshop Item |
| Published: |
2014
|
| Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73191 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | National University of Singapore |
| id |
sg-nus-scholar.10635-73191 |
|---|---|
| record_format |
dspace |
| spelling |
sg-nus-scholar.10635-731912024-11-08T17:45:23Z Analytical solutions for interconnect stress in board level drop impact Wong, E.H. Mai, Y.-W. Seah, S.K.W. Lim, K.M. Lim, T.B. MECHANICAL ENGINEERING 10.1109/ECTC.2006.1645905 Proceedings - Electronic Components and Technology Conference 2006 1808-1815 PECCA 2014-06-19T05:32:13Z 2014-06-19T05:32:13Z 2006 Conference Paper Wong, E.H., Mai, Y.-W., Seah, S.K.W., Lim, K.M., Lim, T.B. (2006). Analytical solutions for interconnect stress in board level drop impact. Proceedings - Electronic Components and Technology Conference 2006 : 1808-1815. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2006.1645905 1424401526 05695503 http://scholarbank.nus.edu.sg/handle/10635/73191 000238566601114 Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| description |
10.1109/ECTC.2006.1645905 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Wong, E.H. Mai, Y.-W. Seah, S.K.W. Lim, K.M. Lim, T.B. |
| format |
Conference or Workshop Item |
| author |
Wong, E.H. Mai, Y.-W. Seah, S.K.W. Lim, K.M. Lim, T.B. |
| spellingShingle |
Wong, E.H. Mai, Y.-W. Seah, S.K.W. Lim, K.M. Lim, T.B. Analytical solutions for interconnect stress in board level drop impact |
| author_sort |
Wong, E.H. |
| title |
Analytical solutions for interconnect stress in board level drop impact |
| title_short |
Analytical solutions for interconnect stress in board level drop impact |
| title_full |
Analytical solutions for interconnect stress in board level drop impact |
| title_fullStr |
Analytical solutions for interconnect stress in board level drop impact |
| title_full_unstemmed |
Analytical solutions for interconnect stress in board level drop impact |
| title_sort |
analytical solutions for interconnect stress in board level drop impact |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73191 |
| _version_ |
1821210477133299712 |