Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging

Processing and Fabrication of Advanced Materials XIV With Frontiers in Materials Science 2005: Innovative Materials and Manufacturing Techniques - Proceedings of a Symposium

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Main Authors:	Gupta, M., Pan, M.Y., Tay, A.A.O., Vaidyanathan, K.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73347
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73347
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spelling	sg-nus-scholar.10635-733472015-02-07T16:50:45Z Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging Gupta, M. Pan, M.Y. Tay, A.A.O. Vaidyanathan, K. MECHANICAL ENGINEERING Processing and Fabrication of Advanced Materials XIV With Frontiers in Materials Science 2005: Innovative Materials and Manufacturing Techniques - Proceedings of a Symposium 123-137 2014-06-19T05:34:02Z 2014-06-19T05:34:02Z 2005 Conference Paper Gupta, M.,Pan, M.Y.,Tay, A.A.O.,Vaidyanathan, K. (2005). Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging. Processing and Fabrication of Advanced Materials XIV With Frontiers in Materials Science 2005: Innovative Materials and Manufacturing Techniques - Proceedings of a Symposium : 123-137. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/73347 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Processing and Fabrication of Advanced Materials XIV With Frontiers in Materials Science 2005: Innovative Materials and Manufacturing Techniques - Proceedings of a Symposium
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Gupta, M. Pan, M.Y. Tay, A.A.O. Vaidyanathan, K.
format	Conference or Workshop Item
author	Gupta, M. Pan, M.Y. Tay, A.A.O. Vaidyanathan, K.
spellingShingle	Gupta, M. Pan, M.Y. Tay, A.A.O. Vaidyanathan, K. Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging
author_sort	Gupta, M.
title	Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging
title_short	Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging
title_full	Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging
title_fullStr	Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging
title_full_unstemmed	Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging
title_sort	development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73347
_version_	1681087731659177984

Development of bulk nanostructured copper with superior hardness for use as an interconnect material in electronic packaging

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