Experimental investigation of microgap cooling technology for minimizing temperature gradient and mitigating hotspots in electronic devices

10.1109/EPTC.2011.6184478

Saved in:
Bibliographic Details
Main Authors: Alam, T., Lee, P.S., Yap, C.R., Jin, L.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73448
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
id sg-nus-scholar.10635-73448
record_format dspace
spelling sg-nus-scholar.10635-734482015-01-07T07:22:48Z Experimental investigation of microgap cooling technology for minimizing temperature gradient and mitigating hotspots in electronic devices Alam, T. Lee, P.S. Yap, C.R. Jin, L. MECHANICAL ENGINEERING 10.1109/EPTC.2011.6184478 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 530-535 2014-06-19T05:35:14Z 2014-06-19T05:35:14Z 2011 Conference Paper Alam, T.,Lee, P.S.,Yap, C.R.,Jin, L. (2011). Experimental investigation of microgap cooling technology for minimizing temperature gradient and mitigating hotspots in electronic devices. 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 : 530-535. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EPTC.2011.6184478" target="_blank">https://doi.org/10.1109/EPTC.2011.6184478</a> 9781457719837 http://scholarbank.nus.edu.sg/handle/10635/73448 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description 10.1109/EPTC.2011.6184478
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Alam, T.
Lee, P.S.
Yap, C.R.
Jin, L.
format Conference or Workshop Item
author Alam, T.
Lee, P.S.
Yap, C.R.
Jin, L.
spellingShingle Alam, T.
Lee, P.S.
Yap, C.R.
Jin, L.
Experimental investigation of microgap cooling technology for minimizing temperature gradient and mitigating hotspots in electronic devices
author_sort Alam, T.
title Experimental investigation of microgap cooling technology for minimizing temperature gradient and mitigating hotspots in electronic devices
title_short Experimental investigation of microgap cooling technology for minimizing temperature gradient and mitigating hotspots in electronic devices
title_full Experimental investigation of microgap cooling technology for minimizing temperature gradient and mitigating hotspots in electronic devices
title_fullStr Experimental investigation of microgap cooling technology for minimizing temperature gradient and mitigating hotspots in electronic devices
title_full_unstemmed Experimental investigation of microgap cooling technology for minimizing temperature gradient and mitigating hotspots in electronic devices
title_sort experimental investigation of microgap cooling technology for minimizing temperature gradient and mitigating hotspots in electronic devices
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/73448
_version_ 1681087750077415424