Experimental investigation of microgap cooling technology for minimizing temperature gradient and mitigating hotspots in electronic devices

10.1109/EPTC.2011.6184478

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Bibliographic Details
Main Authors: Alam, T., Lee, P.S., Yap, C.R., Jin, L.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73448
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Institution: National University of Singapore
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