Experimental investigation of microgap cooling technology for minimizing temperature gradient and mitigating hotspots in electronic devices
10.1109/EPTC.2011.6184478
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Main Authors: | Alam, T., Lee, P.S., Yap, C.R., Jin, L. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73448 |
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Institution: | National University of Singapore |
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