Fracture mechanics analysis of delamination failures in I'C packages
10.1109/IPFA.2009.5232725
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2014
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sg-nus-scholar.10635-734832015-01-07T20:12:08Z Fracture mechanics analysis of delamination failures in I'C packages Tay, A.A.O. MECHANICAL ENGINEERING 10.1109/IPFA.2009.5232725 Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 768-775 2014-06-19T05:35:38Z 2014-06-19T05:35:38Z 2009 Conference Paper Tay, A.A.O. (2009). Fracture mechanics analysis of delamination failures in I'C packages. Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA : 768-775. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/IPFA.2009.5232725" target="_blank">https://doi.org/10.1109/IPFA.2009.5232725</a> 9781424439102 http://scholarbank.nus.edu.sg/handle/10635/73483 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
10.1109/IPFA.2009.5232725 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Tay, A.A.O. |
| format |
Conference or Workshop Item |
| author |
Tay, A.A.O. |
| spellingShingle |
Tay, A.A.O. Fracture mechanics analysis of delamination failures in I'C packages |
| author_sort |
Tay, A.A.O. |
| title |
Fracture mechanics analysis of delamination failures in I'C packages |
| title_short |
Fracture mechanics analysis of delamination failures in I'C packages |
| title_full |
Fracture mechanics analysis of delamination failures in I'C packages |
| title_fullStr |
Fracture mechanics analysis of delamination failures in I'C packages |
| title_full_unstemmed |
Fracture mechanics analysis of delamination failures in I'C packages |
| title_sort |
fracture mechanics analysis of delamination failures in i'c packages |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73483 |
| _version_ |
1681087756533497856 |