Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages

Proceedings - Electronic Components and Technology Conference

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Main Authors: Tay, A.A.O., Zhu, H.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73484
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-734842015-01-07T18:29:12Z Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages Tay, A.A.O. Zhu, H. MECHANICAL ENGINEERING Proceedings - Electronic Components and Technology Conference 620-623 PECCA 2014-06-19T05:35:39Z 2014-06-19T05:35:39Z 2001 Conference Paper Tay, A.A.O.,Zhu, H. (2001). Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages. Proceedings - Electronic Components and Technology Conference : 620-623. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/73484 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Proceedings - Electronic Components and Technology Conference
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Tay, A.A.O.
Zhu, H.
format Conference or Workshop Item
author Tay, A.A.O.
Zhu, H.
spellingShingle Tay, A.A.O.
Zhu, H.
Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages
author_sort Tay, A.A.O.
title Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages
title_short Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages
title_full Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages
title_fullStr Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages
title_full_unstemmed Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages
title_sort fracture mechanics analysis of the effect of geometry on delaminations in rectangular ic packages
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/73484
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