Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages
Proceedings - Electronic Components and Technology Conference
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2014
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sg-nus-scholar.10635-734842015-01-07T18:29:12Z Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages Tay, A.A.O. Zhu, H. MECHANICAL ENGINEERING Proceedings - Electronic Components and Technology Conference 620-623 PECCA 2014-06-19T05:35:39Z 2014-06-19T05:35:39Z 2001 Conference Paper Tay, A.A.O.,Zhu, H. (2001). Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages. Proceedings - Electronic Components and Technology Conference : 620-623. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/73484 NOT_IN_WOS Scopus |
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Proceedings - Electronic Components and Technology Conference |
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MECHANICAL ENGINEERING |
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MECHANICAL ENGINEERING Tay, A.A.O. Zhu, H. |
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Conference or Workshop Item |
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Tay, A.A.O. Zhu, H. |
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Tay, A.A.O. Zhu, H. Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages |
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Tay, A.A.O. |
title |
Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages |
title_short |
Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages |
title_full |
Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages |
title_fullStr |
Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages |
title_full_unstemmed |
Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages |
title_sort |
fracture mechanics analysis of the effect of geometry on delaminations in rectangular ic packages |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/73484 |
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