Influence of non-uniform initial porosity distribution on adhesive failure in electronic packages

Influence of non-uniform initial porosity distribution on adhesive failure in electronic packages

Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

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Bibliographic Details
Main Authors: Chew, H.B., Guo, T.F., Cheng, L.
Other Authors: MATERIALS SCIENCE
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73535
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Institution: National University of Singapore
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Summary:Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

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