Influence of vapor pressure on rate-dependent void growth in IC packages
Proceedings of the Electronic Packaging Technology Conference, EPTC
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sg-nus-scholar.10635-735372018-12-18T23:38:36Z Influence of vapor pressure on rate-dependent void growth in IC packages Wong, W.H. Guo, T.F. Cheng, L. MATERIALS SCIENCE AND ENGINEERING MECHANICAL ENGINEERING Proceedings of the Electronic Packaging Technology Conference, EPTC 664-669 2014-06-19T05:36:18Z 2014-06-19T05:36:18Z 2007 Conference Paper Wong, W.H., Guo, T.F., Cheng, L. (2007). Influence of vapor pressure on rate-dependent void growth in IC packages. Proceedings of the Electronic Packaging Technology Conference, EPTC : 664-669. ScholarBank@NUS Repository. 1424413249 http://scholarbank.nus.edu.sg/handle/10635/73537 000253874600120 Scopus |
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Proceedings of the Electronic Packaging Technology Conference, EPTC |
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MATERIALS SCIENCE AND ENGINEERING |
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MATERIALS SCIENCE AND ENGINEERING Wong, W.H. Guo, T.F. Cheng, L. |
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Conference or Workshop Item |
author |
Wong, W.H. Guo, T.F. Cheng, L. |
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Wong, W.H. Guo, T.F. Cheng, L. Influence of vapor pressure on rate-dependent void growth in IC packages |
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Wong, W.H. |
title |
Influence of vapor pressure on rate-dependent void growth in IC packages |
title_short |
Influence of vapor pressure on rate-dependent void growth in IC packages |
title_full |
Influence of vapor pressure on rate-dependent void growth in IC packages |
title_fullStr |
Influence of vapor pressure on rate-dependent void growth in IC packages |
title_full_unstemmed |
Influence of vapor pressure on rate-dependent void growth in IC packages |
title_sort |
influence of vapor pressure on rate-dependent void growth in ic packages |
publishDate |
2014 |
url |
http://scholarbank.nus.edu.sg/handle/10635/73537 |
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1681087766361800704 |