Mechanics of interfacial delamination in IC packages undergoing solder reflow

10.1109/HDP.2005.251380

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Bibliographic Details
Main Author:	Tay, A.A.O.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73595
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Institution:	National University of Singapore

Description
Summary:	10.1109/HDP.2005.251380

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