Mechanics of interfacial delamination in IC packages undergoing solder reflow
10.1109/HDP.2005.251380
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2014
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sg-nus-scholar.10635-735952015-02-22T03:55:35Z Mechanics of interfacial delamination in IC packages undergoing solder reflow Tay, A.A.O. MECHANICAL ENGINEERING 10.1109/HDP.2005.251380 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05 - 2014-06-19T05:37:02Z 2014-06-19T05:37:02Z 2006 Conference Paper Tay, A.A.O. (2006). Mechanics of interfacial delamination in IC packages undergoing solder reflow. 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05 : -. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/HDP.2005.251380" target="_blank">https://doi.org/10.1109/HDP.2005.251380</a> 0780392930 http://scholarbank.nus.edu.sg/handle/10635/73595 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
10.1109/HDP.2005.251380 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Tay, A.A.O. |
| format |
Conference or Workshop Item |
| author |
Tay, A.A.O. |
| spellingShingle |
Tay, A.A.O. Mechanics of interfacial delamination in IC packages undergoing solder reflow |
| author_sort |
Tay, A.A.O. |
| title |
Mechanics of interfacial delamination in IC packages undergoing solder reflow |
| title_short |
Mechanics of interfacial delamination in IC packages undergoing solder reflow |
| title_full |
Mechanics of interfacial delamination in IC packages undergoing solder reflow |
| title_fullStr |
Mechanics of interfacial delamination in IC packages undergoing solder reflow |
| title_full_unstemmed |
Mechanics of interfacial delamination in IC packages undergoing solder reflow |
| title_sort |
mechanics of interfacial delamination in ic packages undergoing solder reflow |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73595 |
| _version_ |
1681087776726974464 |