Modeling of solder joint failure due to PCB bending during drop impact
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
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2014
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sg-nus-scholar.10635-736342015-05-24T00:28:04Z Modeling of solder joint failure due to PCB bending during drop impact Jie, G. Lim, C.T. Tay, A.A.O. MECHANICAL ENGINEERING Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 678-683 2014-06-19T05:37:32Z 2014-06-19T05:37:32Z 2004 Conference Paper Jie, G.,Lim, C.T.,Tay, A.A.O. (2004). Modeling of solder joint failure due to PCB bending during drop impact. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 678-683. ScholarBank@NUS Repository. 0780388216 http://scholarbank.nus.edu.sg/handle/10635/73634 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Jie, G. Lim, C.T. Tay, A.A.O. |
| format |
Conference or Workshop Item |
| author |
Jie, G. Lim, C.T. Tay, A.A.O. |
| spellingShingle |
Jie, G. Lim, C.T. Tay, A.A.O. Modeling of solder joint failure due to PCB bending during drop impact |
| author_sort |
Jie, G. |
| title |
Modeling of solder joint failure due to PCB bending during drop impact |
| title_short |
Modeling of solder joint failure due to PCB bending during drop impact |
| title_full |
Modeling of solder joint failure due to PCB bending during drop impact |
| title_fullStr |
Modeling of solder joint failure due to PCB bending during drop impact |
| title_full_unstemmed |
Modeling of solder joint failure due to PCB bending during drop impact |
| title_sort |
modeling of solder joint failure due to pcb bending during drop impact |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73634 |
| _version_ |
1681087783837368320 |