Nanoindentation study of sputtered Al-Cu thin films for interconnect applications
10.1109/EPTC.2006.342774
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2014
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sg-nus-scholar.10635-736642015-03-24T06:37:58Z Nanoindentation study of sputtered Al-Cu thin films for interconnect applications Kumar, A. Jayaganthan, R. Chandra, R. Chawla, V. Tay, A.A.O. MECHANICAL ENGINEERING 10.1109/EPTC.2006.342774 Proceedings of the Electronic Packaging Technology Conference, EPTC 560-564 2014-06-19T05:37:52Z 2014-06-19T05:37:52Z 2006 Conference Paper Kumar, A.,Jayaganthan, R.,Chandra, R.,Chawla, V.,Tay, A.A.O. (2006). Nanoindentation study of sputtered Al-Cu thin films for interconnect applications. Proceedings of the Electronic Packaging Technology Conference, EPTC : 560-564. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EPTC.2006.342774" target="_blank">https://doi.org/10.1109/EPTC.2006.342774</a> 142440665X http://scholarbank.nus.edu.sg/handle/10635/73664 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
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NUS Library |
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Singapore |
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ScholarBank@NUS |
| description |
10.1109/EPTC.2006.342774 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Kumar, A. Jayaganthan, R. Chandra, R. Chawla, V. Tay, A.A.O. |
| format |
Conference or Workshop Item |
| author |
Kumar, A. Jayaganthan, R. Chandra, R. Chawla, V. Tay, A.A.O. |
| spellingShingle |
Kumar, A. Jayaganthan, R. Chandra, R. Chawla, V. Tay, A.A.O. Nanoindentation study of sputtered Al-Cu thin films for interconnect applications |
| author_sort |
Kumar, A. |
| title |
Nanoindentation study of sputtered Al-Cu thin films for interconnect applications |
| title_short |
Nanoindentation study of sputtered Al-Cu thin films for interconnect applications |
| title_full |
Nanoindentation study of sputtered Al-Cu thin films for interconnect applications |
| title_fullStr |
Nanoindentation study of sputtered Al-Cu thin films for interconnect applications |
| title_full_unstemmed |
Nanoindentation study of sputtered Al-Cu thin films for interconnect applications |
| title_sort |
nanoindentation study of sputtered al-cu thin films for interconnect applications |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73664 |
| _version_ |
1681087789256409088 |