Nanoindentation study of the sputtered Cu thin films for interconnect applications

Nanoindentation study of the sputtered Cu thin films for interconnect applications

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Saved in:
Bibliographic Details
Main Authors: Srinivasarao, V., Jayaganthan, R., Sekhar, V.N., Mohankumar, K., Tay, A.A.O., Kripesh, V.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73666
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/73666

Similar Items