Nanoindentation study of the sputtered Cu thin films for interconnect applications

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

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Bibliographic Details
Main Authors:	Srinivasarao, V., Jayaganthan, R., Sekhar, V.N., Mohankumar, K., Tay, A.A.O., Kripesh, V.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73666
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73666
record_format	dspace
spelling	sg-nus-scholar.10635-736662015-01-06T07:06:47Z Nanoindentation study of the sputtered Cu thin films for interconnect applications Srinivasarao, V. Jayaganthan, R. Sekhar, V.N. Mohankumar, K. Tay, A.A.O. Kripesh, V. MECHANICAL ENGINEERING Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 343-347 2014-06-19T05:37:54Z 2014-06-19T05:37:54Z 2004 Conference Paper Srinivasarao, V.,Jayaganthan, R.,Sekhar, V.N.,Mohankumar, K.,Tay, A.A.O.,Kripesh, V. (2004). Nanoindentation study of the sputtered Cu thin films for interconnect applications. Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004 : 343-347. ScholarBank@NUS Repository. 0780388216 http://scholarbank.nus.edu.sg/handle/10635/73666 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Srinivasarao, V. Jayaganthan, R. Sekhar, V.N. Mohankumar, K. Tay, A.A.O. Kripesh, V.
format	Conference or Workshop Item
author	Srinivasarao, V. Jayaganthan, R. Sekhar, V.N. Mohankumar, K. Tay, A.A.O. Kripesh, V.
spellingShingle	Srinivasarao, V. Jayaganthan, R. Sekhar, V.N. Mohankumar, K. Tay, A.A.O. Kripesh, V. Nanoindentation study of the sputtered Cu thin films for interconnect applications
author_sort	Srinivasarao, V.
title	Nanoindentation study of the sputtered Cu thin films for interconnect applications
title_short	Nanoindentation study of the sputtered Cu thin films for interconnect applications
title_full	Nanoindentation study of the sputtered Cu thin films for interconnect applications
title_fullStr	Nanoindentation study of the sputtered Cu thin films for interconnect applications
title_full_unstemmed	Nanoindentation study of the sputtered Cu thin films for interconnect applications
title_sort	nanoindentation study of the sputtered cu thin films for interconnect applications
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73666
_version_	1681087789598244864

Nanoindentation study of the sputtered Cu thin films for interconnect applications

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