Predicting failure sites and failure modes in an IC package using a variable order boundary element method
Advances in Electronic Packaging
Saved in:
Main Authors: | , , , |
---|---|
Other Authors: | |
Format: | Conference or Workshop Item |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73769 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
id |
sg-nus-scholar.10635-73769 |
---|---|
record_format |
dspace |
spelling |
sg-nus-scholar.10635-737692015-01-25T13:31:39Z Predicting failure sites and failure modes in an IC package using a variable order boundary element method Tay, A.A.O. Lee, K.H. Zhou, W. Lim, K.M. MECHANICAL ENGINEERING Advances in Electronic Packaging 2 1271-1278 2014-06-19T05:39:08Z 2014-06-19T05:39:08Z 2001 Conference Paper Tay, A.A.O.,Lee, K.H.,Zhou, W.,Lim, K.M. (2001). Predicting failure sites and failure modes in an IC package using a variable order boundary element method. Advances in Electronic Packaging 2 : 1271-1278. ScholarBank@NUS Repository. 0791835405 http://scholarbank.nus.edu.sg/handle/10635/73769 NOT_IN_WOS Scopus |
institution |
National University of Singapore |
building |
NUS Library |
country |
Singapore |
collection |
ScholarBank@NUS |
description |
Advances in Electronic Packaging |
author2 |
MECHANICAL ENGINEERING |
author_facet |
MECHANICAL ENGINEERING Tay, A.A.O. Lee, K.H. Zhou, W. Lim, K.M. |
format |
Conference or Workshop Item |
author |
Tay, A.A.O. Lee, K.H. Zhou, W. Lim, K.M. |
spellingShingle |
Tay, A.A.O. Lee, K.H. Zhou, W. Lim, K.M. Predicting failure sites and failure modes in an IC package using a variable order boundary element method |
author_sort |
Tay, A.A.O. |
title |
Predicting failure sites and failure modes in an IC package using a variable order boundary element method |
title_short |
Predicting failure sites and failure modes in an IC package using a variable order boundary element method |
title_full |
Predicting failure sites and failure modes in an IC package using a variable order boundary element method |
title_fullStr |
Predicting failure sites and failure modes in an IC package using a variable order boundary element method |
title_full_unstemmed |
Predicting failure sites and failure modes in an IC package using a variable order boundary element method |
title_sort |
predicting failure sites and failure modes in an ic package using a variable order boundary element method |
publishDate |
2014 |
url |
http://scholarbank.nus.edu.sg/handle/10635/73769 |
_version_ |
1681087808131825664 |