Predicting failure sites and failure modes in an IC package using a variable order boundary element method

Predicting failure sites and failure modes in an IC package using a variable order boundary element method

Advances in Electronic Packaging

Saved in:
Bibliographic Details
Main Authors: Tay, A.A.O., Lee, K.H., Zhou, W., Lim, K.M.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73769
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/73769

Similar Items