Quantifying adhesion strength for Cu/Ta barriers/FTEOS dielectric using modified edge lift off test

Advanced Metallization Conference (AMC)

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Main Authors:	Ho, C.S., Yong, C., Zhang, B.C., Lim, C.Y.H.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73794
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73794
record_format	dspace
spelling	sg-nus-scholar.10635-737942015-01-07T15:35:24Z Quantifying adhesion strength for Cu/Ta barriers/FTEOS dielectric using modified edge lift off test Ho, C.S. Yong, C. Zhang, B.C. Lim, C.Y.H. MECHANICAL ENGINEERING Advanced Metallization Conference (AMC) 657-662 MRSPD 2014-06-19T05:39:25Z 2014-06-19T05:39:25Z 2004 Conference Paper Ho, C.S.,Yong, C.,Zhang, B.C.,Lim, C.Y.H. (2004). Quantifying adhesion strength for Cu/Ta barriers/FTEOS dielectric using modified edge lift off test. Advanced Metallization Conference (AMC) : 657-662. ScholarBank@NUS Repository. 15401766 http://scholarbank.nus.edu.sg/handle/10635/73794 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Advanced Metallization Conference (AMC)
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Ho, C.S. Yong, C. Zhang, B.C. Lim, C.Y.H.
format	Conference or Workshop Item
author	Ho, C.S. Yong, C. Zhang, B.C. Lim, C.Y.H.
spellingShingle	Ho, C.S. Yong, C. Zhang, B.C. Lim, C.Y.H. Quantifying adhesion strength for Cu/Ta barriers/FTEOS dielectric using modified edge lift off test
author_sort	Ho, C.S.
title	Quantifying adhesion strength for Cu/Ta barriers/FTEOS dielectric using modified edge lift off test
title_short	Quantifying adhesion strength for Cu/Ta barriers/FTEOS dielectric using modified edge lift off test
title_full	Quantifying adhesion strength for Cu/Ta barriers/FTEOS dielectric using modified edge lift off test
title_fullStr	Quantifying adhesion strength for Cu/Ta barriers/FTEOS dielectric using modified edge lift off test
title_full_unstemmed	Quantifying adhesion strength for Cu/Ta barriers/FTEOS dielectric using modified edge lift off test
title_sort	quantifying adhesion strength for cu/ta barriers/fteos dielectric using modified edge lift off test
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73794
_version_	1681087812499144704

Quantifying adhesion strength for Cu/Ta barriers/FTEOS dielectric using modified edge lift off test

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