Quantifying adhesion strength for Cu/Ta barriers/FTEOS dielectric using modified edge lift off test

Advanced Metallization Conference (AMC)

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Bibliographic Details
Main Authors: Ho, C.S., Yong, C., Zhang, B.C., Lim, C.Y.H.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73794
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Institution: National University of Singapore

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