Quantifying adhesion strength for Cu/Ta barriers/FTEOS dielectric using modified edge lift off test

بواسطة Ho, C.S., Yong, C., Zhang, B.C., Lim, C.Y.H.
منشور في 2014

Uniform void-free epitaxial CoSi 2 formation on STI bounded narrow Si(lOO) lines by template layer stress reduction

بواسطة Ho, C.S., Pey, K.L., Tung, C.H., Zhang, B.C., Tee, K.C., Karunasiri, G., Chua, S.J.
منشور في 2014

Strain profiling of HfO2/Si(001) interface with high-resolution Rutherford backscattering spectroscopy

بواسطة Nakajima, K., Joumori, S., Suzuki, M., Kimura, K., Osipowicz, T., Tok, K.L., Zheng, J.Z., See, A., Zhang, B.C.
منشور في 2014

Characterization of HfO2/Si(0 0 1) interface with high-resolution rutherford backscattering spectroscopy

بواسطة Nakajima, K., Joumori, S., Suzuki, M., Kimura, K., Osipowicz, T., Tok, K.L., Zheng, J.Z., See, A., Zhang, B.C.
منشور في 2014

Cool copper template for the formation of oriented nanocrystalline α-tantalum

بواسطة Yong, C., Zhang, B.C., Seet, C.S., See, A., Chan, L., Sudijono, J., Liew, S.L., Tung, C.-H., Zeng, H.C.
منشور في 2014

Effects of first rapid thermal annealing temperature on Co silicide formation

بواسطة Peng, H.J., Shen, Z.X., Lim, E.H., Lai, C.W., Liu, R., Wee, A.T.S., Sameer, A., Dai, J.Y., Zhang, B.C., Zheng, J.Z.
منشور في 2014

Via resistance reduction using "cool" PVD-Ta processing

بواسطة Seet, C.S., Zhang, B.C., Yong, C., Liew, S.L., Li, K., Hsia, L.C., Seng, H.L., Osiposwicz, T., Sudijono, J., Zeng, H.C., Tan, J.B.
منشور في 2014