Simulation of mechanical response of solder joints under drop impact using equivalent layer models

Simulation of mechanical response of solder joints under drop impact using equivalent layer models

Proceedings - Electronic Components and Technology Conference

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Bibliographic Details
Main Authors: Gu, J., Lim, C.T., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73854
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Institution: National University of Singapore
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Summary:Proceedings - Electronic Components and Technology Conference

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