Simulation of mechanical response of solder joints under drop impact using equivalent layer models

Proceedings - Electronic Components and Technology Conference

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Bibliographic Details
Main Authors:	Gu, J., Lim, C.T., Tay, A.A.O.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73854
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73854
record_format	dspace
spelling	sg-nus-scholar.10635-738542015-01-25T10:18:19Z Simulation of mechanical response of solder joints under drop impact using equivalent layer models Gu, J. Lim, C.T. Tay, A.A.O. MECHANICAL ENGINEERING Proceedings - Electronic Components and Technology Conference 1 491-498 PECCA 2014-06-19T05:40:10Z 2014-06-19T05:40:10Z 2005 Conference Paper Gu, J.,Lim, C.T.,Tay, A.A.O. (2005). Simulation of mechanical response of solder joints under drop impact using equivalent layer models. Proceedings - Electronic Components and Technology Conference 1 : 491-498. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/73854 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Proceedings - Electronic Components and Technology Conference
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Gu, J. Lim, C.T. Tay, A.A.O.
format	Conference or Workshop Item
author	Gu, J. Lim, C.T. Tay, A.A.O.
spellingShingle	Gu, J. Lim, C.T. Tay, A.A.O. Simulation of mechanical response of solder joints under drop impact using equivalent layer models
author_sort	Gu, J.
title	Simulation of mechanical response of solder joints under drop impact using equivalent layer models
title_short	Simulation of mechanical response of solder joints under drop impact using equivalent layer models
title_full	Simulation of mechanical response of solder joints under drop impact using equivalent layer models
title_fullStr	Simulation of mechanical response of solder joints under drop impact using equivalent layer models
title_full_unstemmed	Simulation of mechanical response of solder joints under drop impact using equivalent layer models
title_sort	simulation of mechanical response of solder joints under drop impact using equivalent layer models
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73854
_version_	1681087823427403776

Simulation of mechanical response of solder joints under drop impact using equivalent layer models

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