Suppressing intermetallic compound growth in SnAgCu solder joints with addition of carbon nanotubes

Suppressing intermetallic compound growth in SnAgCu solder joints with addition of carbon nanotubes

10.1109/INEC.2008.4585428

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Bibliographic Details
Main Authors: Nai, S.M.L., Gupta, M., Wei, J.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73898
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Institution: National University of Singapore
Description
Summary:10.1109/INEC.2008.4585428

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