Suppressing intermetallic compound growth in SnAgCu solder joints with addition of carbon nanotubes

10.1109/INEC.2008.4585428

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Main Authors: Nai, S.M.L., Gupta, M., Wei, J.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73898
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-738982023-10-25T20:39:08Z Suppressing intermetallic compound growth in SnAgCu solder joints with addition of carbon nanotubes Nai, S.M.L. Gupta, M. Wei, J. MECHANICAL ENGINEERING 10.1109/INEC.2008.4585428 2008 2nd IEEE International Nanoelectronics Conference, INEC 2008 15-19 2014-06-19T05:40:40Z 2014-06-19T05:40:40Z 2008 Conference Paper Nai, S.M.L., Gupta, M., Wei, J. (2008). Suppressing intermetallic compound growth in SnAgCu solder joints with addition of carbon nanotubes. 2008 2nd IEEE International Nanoelectronics Conference, INEC 2008 : 15-19. ScholarBank@NUS Repository. https://doi.org/10.1109/INEC.2008.4585428 9781424415731 http://scholarbank.nus.edu.sg/handle/10635/73898 000259893500004 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description 10.1109/INEC.2008.4585428
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Nai, S.M.L.
Gupta, M.
Wei, J.
format Conference or Workshop Item
author Nai, S.M.L.
Gupta, M.
Wei, J.
spellingShingle Nai, S.M.L.
Gupta, M.
Wei, J.
Suppressing intermetallic compound growth in SnAgCu solder joints with addition of carbon nanotubes
author_sort Nai, S.M.L.
title Suppressing intermetallic compound growth in SnAgCu solder joints with addition of carbon nanotubes
title_short Suppressing intermetallic compound growth in SnAgCu solder joints with addition of carbon nanotubes
title_full Suppressing intermetallic compound growth in SnAgCu solder joints with addition of carbon nanotubes
title_fullStr Suppressing intermetallic compound growth in SnAgCu solder joints with addition of carbon nanotubes
title_full_unstemmed Suppressing intermetallic compound growth in SnAgCu solder joints with addition of carbon nanotubes
title_sort suppressing intermetallic compound growth in snagcu solder joints with addition of carbon nanotubes
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/73898
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