Thermal analysis of high-powered devices using analytical and experimental methods
10.1109/ICEPT-HDP.2012.6474902
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sg-nus-scholar.10635-739552015-02-21T22:56:44Z Thermal analysis of high-powered devices using analytical and experimental methods Ling, J.H.L. Tay, A.A.O. Choo, K.F. MECHANICAL ENGINEERING 10.1109/ICEPT-HDP.2012.6474902 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging 1550-1555 2014-06-19T05:41:22Z 2014-06-19T05:41:22Z 2012 Conference Paper Ling, J.H.L.,Tay, A.A.O.,Choo, K.F. (2012). Thermal analysis of high-powered devices using analytical and experimental methods. ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging : 1550-1555. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ICEPT-HDP.2012.6474902" target="_blank">https://doi.org/10.1109/ICEPT-HDP.2012.6474902</a> 9781467316804 http://scholarbank.nus.edu.sg/handle/10635/73955 NOT_IN_WOS Scopus |
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10.1109/ICEPT-HDP.2012.6474902 |
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MECHANICAL ENGINEERING |
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MECHANICAL ENGINEERING Ling, J.H.L. Tay, A.A.O. Choo, K.F. |
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Conference or Workshop Item |
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Ling, J.H.L. Tay, A.A.O. Choo, K.F. |
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Ling, J.H.L. Tay, A.A.O. Choo, K.F. Thermal analysis of high-powered devices using analytical and experimental methods |
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Ling, J.H.L. |
title |
Thermal analysis of high-powered devices using analytical and experimental methods |
title_short |
Thermal analysis of high-powered devices using analytical and experimental methods |
title_full |
Thermal analysis of high-powered devices using analytical and experimental methods |
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Thermal analysis of high-powered devices using analytical and experimental methods |
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Thermal analysis of high-powered devices using analytical and experimental methods |
title_sort |
thermal analysis of high-powered devices using analytical and experimental methods |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/73955 |
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