Thermal analysis of high-powered devices using analytical and experimental methods

• Main Authors: Ling, J.H.L., Tay, A.A.O., Choo, K.F.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73955
• Institution: National University of Singapore

10.1109/ICEPT-HDP.2012.6474902