Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package
Proceedings - Electronic Components and Technology Conference
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2014
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sg-nus-scholar.10635-739772015-02-21T01:19:45Z Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package Tay, A.A.O. Lee, W.H. MECHANICAL ENGINEERING Proceedings - Electronic Components and Technology Conference 897-904 PECCA 2014-06-19T05:41:39Z 2014-06-19T05:41:39Z 2002 Conference Paper Tay, A.A.O.,Lee, W.H. (2002). Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package. Proceedings - Electronic Components and Technology Conference : 897-904. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/73977 NOT_IN_WOS Scopus |
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Proceedings - Electronic Components and Technology Conference |
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MECHANICAL ENGINEERING |
author_facet |
MECHANICAL ENGINEERING Tay, A.A.O. Lee, W.H. |
format |
Conference or Workshop Item |
author |
Tay, A.A.O. Lee, W.H. |
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Tay, A.A.O. Lee, W.H. Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package |
author_sort |
Tay, A.A.O. |
title |
Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package |
title_short |
Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package |
title_full |
Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package |
title_fullStr |
Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package |
title_full_unstemmed |
Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package |
title_sort |
transient three dimensional simulation of mold filling and wire sweep in an overmold bga package |
publishDate |
2014 |
url |
http://scholarbank.nus.edu.sg/handle/10635/73977 |
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1681087845923553280 |