Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package

Proceedings - Electronic Components and Technology Conference

Saved in:
Bibliographic Details
Main Authors: Tay, A.A.O., Lee, W.H.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73977
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
id sg-nus-scholar.10635-73977
record_format dspace
spelling sg-nus-scholar.10635-739772015-02-21T01:19:45Z Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package Tay, A.A.O. Lee, W.H. MECHANICAL ENGINEERING Proceedings - Electronic Components and Technology Conference 897-904 PECCA 2014-06-19T05:41:39Z 2014-06-19T05:41:39Z 2002 Conference Paper Tay, A.A.O.,Lee, W.H. (2002). Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package. Proceedings - Electronic Components and Technology Conference : 897-904. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/73977 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Proceedings - Electronic Components and Technology Conference
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Tay, A.A.O.
Lee, W.H.
format Conference or Workshop Item
author Tay, A.A.O.
Lee, W.H.
spellingShingle Tay, A.A.O.
Lee, W.H.
Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package
author_sort Tay, A.A.O.
title Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package
title_short Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package
title_full Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package
title_fullStr Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package
title_full_unstemmed Transient three dimensional simulation of mold filling and wire sweep in an overmold BGA package
title_sort transient three dimensional simulation of mold filling and wire sweep in an overmold bga package
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/73977
_version_ 1681087845923553280