Vapor pressure and voiding effects on thin film damage

10.1016/j.tsf.2005.09.054

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Bibliographic Details
Main Authors: Chew, H.B., Guo, T.F., Cheng, L.
Other Authors: MATERIALS SCIENCE AND ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73999
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Institution: National University of Singapore