Vapor pressure and voiding effects on thin film damage

• Main Authors: Chew, H.B., Guo, T.F., Cheng, L.
• Other Authors: MATERIALS SCIENCE AND ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Subjects: Discrete voids; Thin film; Vapor pressure; Void shape
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73999
• Institution: National University of Singapore

10.1016/j.tsf.2005.09.054