Vapor pressure and voiding effects on thin film damage
10.1016/j.tsf.2005.09.054
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Main Authors: | Chew, H.B., Guo, T.F., Cheng, L. |
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Other Authors: | MATERIALS SCIENCE AND ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/73999 |
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Institution: | National University of Singapore |
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