Whole-field board strain and displacement characterization during drop impact using a single camera DIC technique

Whole-field board strain and displacement characterization during drop impact using a single camera DIC technique

10.1109/EPTC.2009.5416468

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Bibliographic Details
Main Authors: De Lim, F.Z., Tan, L.B., Quan, C., Tee, T.Y.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/74020
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Institution: National University of Singapore
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Summary:10.1109/EPTC.2009.5416468

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