Whole-field board strain and displacement characterization during drop impact using a single camera DIC technique
10.1109/EPTC.2009.5416468
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2014
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sg-nus-scholar.10635-740202023-10-30T09:59:09Z Whole-field board strain and displacement characterization during drop impact using a single camera DIC technique De Lim, F.Z. Tan, L.B. Quan, C. Tee, T.Y. MECHANICAL ENGINEERING 10.1109/EPTC.2009.5416468 Proceedings of the Electronic Packaging Technology Conference, EPTC 652-655 2014-06-19T05:42:09Z 2014-06-19T05:42:09Z 2009 Conference Paper De Lim, F.Z., Tan, L.B., Quan, C., Tee, T.Y. (2009). Whole-field board strain and displacement characterization during drop impact using a single camera DIC technique. Proceedings of the Electronic Packaging Technology Conference, EPTC : 652-655. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2009.5416468 9781424451005 http://scholarbank.nus.edu.sg/handle/10635/74020 000288404200115 Scopus |
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National University of Singapore |
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NUS Library |
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Asia |
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Singapore Singapore |
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NUS Library |
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| description |
10.1109/EPTC.2009.5416468 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING De Lim, F.Z. Tan, L.B. Quan, C. Tee, T.Y. |
| format |
Conference or Workshop Item |
| author |
De Lim, F.Z. Tan, L.B. Quan, C. Tee, T.Y. |
| spellingShingle |
De Lim, F.Z. Tan, L.B. Quan, C. Tee, T.Y. Whole-field board strain and displacement characterization during drop impact using a single camera DIC technique |
| author_sort |
De Lim, F.Z. |
| title |
Whole-field board strain and displacement characterization during drop impact using a single camera DIC technique |
| title_short |
Whole-field board strain and displacement characterization during drop impact using a single camera DIC technique |
| title_full |
Whole-field board strain and displacement characterization during drop impact using a single camera DIC technique |
| title_fullStr |
Whole-field board strain and displacement characterization during drop impact using a single camera DIC technique |
| title_full_unstemmed |
Whole-field board strain and displacement characterization during drop impact using a single camera DIC technique |
| title_sort |
whole-field board strain and displacement characterization during drop impact using a single camera dic technique |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/74020 |
| _version_ |
1781783355816148992 |