Whole-field board strain and displacement characterization during drop impact using a single camera DIC technique

• Main Authors: De Lim, F.Z., Tan, L.B., Quan, C., Tee, T.Y.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/74020
• Institution: National University of Singapore

10.1109/EPTC.2009.5416468