Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole and 4-Vinylpyridine

10.1002/pen.20033

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Main Authors: Wang, W.C., Vora, R.H., Kang, E.T., Neoh, K.G.
Other Authors: CHEMICAL & BIOMOLECULAR ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/74563
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-745632023-10-27T09:26:18Z Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole and 4-Vinylpyridine Wang, W.C. Vora, R.H. Kang, E.T. Neoh, K.G. CHEMICAL & BIOMOLECULAR ENGINEERING MATERIALS SCIENCE 10.1002/pen.20033 Polymer Engineering and Science 44 2 362-375 PYESA 2014-06-19T06:13:52Z 2014-06-19T06:13:52Z 2004-02 Conference Paper Wang, W.C., Vora, R.H., Kang, E.T., Neoh, K.G. (2004-02). Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole and 4-Vinylpyridine. Polymer Engineering and Science 44 (2) : 362-375. ScholarBank@NUS Repository. https://doi.org/10.1002/pen.20033 00323888 http://scholarbank.nus.edu.sg/handle/10635/74563 000221597600015 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description 10.1002/pen.20033
author2 CHEMICAL & BIOMOLECULAR ENGINEERING
author_facet CHEMICAL & BIOMOLECULAR ENGINEERING
Wang, W.C.
Vora, R.H.
Kang, E.T.
Neoh, K.G.
format Conference or Workshop Item
author Wang, W.C.
Vora, R.H.
Kang, E.T.
Neoh, K.G.
spellingShingle Wang, W.C.
Vora, R.H.
Kang, E.T.
Neoh, K.G.
Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole and 4-Vinylpyridine
author_sort Wang, W.C.
title Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole and 4-Vinylpyridine
title_short Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole and 4-Vinylpyridine
title_full Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole and 4-Vinylpyridine
title_fullStr Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole and 4-Vinylpyridine
title_full_unstemmed Electroless Plating of Copper on Fluorinated Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole and 4-Vinylpyridine
title_sort electroless plating of copper on fluorinated polyimide films modified by surface graft copolymerization with 1-vinylimidazole and 4-vinylpyridine
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/74563
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