Electroless plating of copper via a Sn-free process on dielectric SiLK surface modified by UV-induced graft copolymerization with 4-vinylpyridine and 1-vinylimidazole

Electroless plating of copper via a Sn-free process on dielectric SiLK surface modified by UV-induced graft copolymerization with 4-vinylpyridine and 1-vinylimidazole

10.1149/1.1507785

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Bibliographic Details
Main Authors: Yu, W.H., Zhang, Y., Kang, E.T., Neoh, K.G., Wu, S.Y., Chow, Y.F.
Other Authors: CHEMICAL & ENVIRONMENTAL ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/91967
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/91967

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