Electroless plating of copper via a Sn-free process on dielectric SiLK surface modified by UV-induced graft copolymerization with 4-vinylpyridine and 1-vinylimidazole

• Main Authors: Yu, W.H., Zhang, Y., Kang, E.T., Neoh, K.G., Wu, S.Y., Chow, Y.F.
• Other Authors: CHEMICAL & ENVIRONMENTAL ENGINEERING
• Format: Article
• Published: 2014
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/91967
• Institution: National University of Singapore

10.1149/1.1507785