Electroless plating of copper via a Sn-free process on dielectric SiLK surface modified by UV-induced graft copolymerization with 4-vinylpyridine and 1-vinylimidazole
10.1149/1.1507785
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2014
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sg-nus-scholar.10635-919672023-10-25T21:15:18Z Electroless plating of copper via a Sn-free process on dielectric SiLK surface modified by UV-induced graft copolymerization with 4-vinylpyridine and 1-vinylimidazole Yu, W.H. Zhang, Y. Kang, E.T. Neoh, K.G. Wu, S.Y. Chow, Y.F. CHEMICAL & ENVIRONMENTAL ENGINEERING 10.1149/1.1507785 Journal of the Electrochemical Society 149 10 C521-C528 JESOA 2014-10-09T09:53:19Z 2014-10-09T09:53:19Z 2002-10 Article Yu, W.H., Zhang, Y., Kang, E.T., Neoh, K.G., Wu, S.Y., Chow, Y.F. (2002-10). Electroless plating of copper via a Sn-free process on dielectric SiLK surface modified by UV-induced graft copolymerization with 4-vinylpyridine and 1-vinylimidazole. Journal of the Electrochemical Society 149 (10) : C521-C528. ScholarBank@NUS Repository. https://doi.org/10.1149/1.1507785 00134651 http://scholarbank.nus.edu.sg/handle/10635/91967 000178030100034 Scopus |
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National University of Singapore |
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NUS Library |
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Asia |
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Singapore Singapore |
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NUS Library |
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| description |
10.1149/1.1507785 |
| author2 |
CHEMICAL & ENVIRONMENTAL ENGINEERING |
| author_facet |
CHEMICAL & ENVIRONMENTAL ENGINEERING Yu, W.H. Zhang, Y. Kang, E.T. Neoh, K.G. Wu, S.Y. Chow, Y.F. |
| format |
Article |
| author |
Yu, W.H. Zhang, Y. Kang, E.T. Neoh, K.G. Wu, S.Y. Chow, Y.F. |
| spellingShingle |
Yu, W.H. Zhang, Y. Kang, E.T. Neoh, K.G. Wu, S.Y. Chow, Y.F. Electroless plating of copper via a Sn-free process on dielectric SiLK surface modified by UV-induced graft copolymerization with 4-vinylpyridine and 1-vinylimidazole |
| author_sort |
Yu, W.H. |
| title |
Electroless plating of copper via a Sn-free process on dielectric SiLK surface modified by UV-induced graft copolymerization with 4-vinylpyridine and 1-vinylimidazole |
| title_short |
Electroless plating of copper via a Sn-free process on dielectric SiLK surface modified by UV-induced graft copolymerization with 4-vinylpyridine and 1-vinylimidazole |
| title_full |
Electroless plating of copper via a Sn-free process on dielectric SiLK surface modified by UV-induced graft copolymerization with 4-vinylpyridine and 1-vinylimidazole |
| title_fullStr |
Electroless plating of copper via a Sn-free process on dielectric SiLK surface modified by UV-induced graft copolymerization with 4-vinylpyridine and 1-vinylimidazole |
| title_full_unstemmed |
Electroless plating of copper via a Sn-free process on dielectric SiLK surface modified by UV-induced graft copolymerization with 4-vinylpyridine and 1-vinylimidazole |
| title_sort |
electroless plating of copper via a sn-free process on dielectric silk surface modified by uv-induced graft copolymerization with 4-vinylpyridine and 1-vinylimidazole |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/91967 |
| _version_ |
1781785721848201216 |