Influence of temperature, humidity and defect location on delamination in plastic IC packages

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

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Bibliographic Details
Main Authors:	Tay, A.A.O., Lin, T.Y.
Other Authors:	MECHANICAL & PRODUCTION ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/75019
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-75019
record_format	dspace
spelling	sg-nus-scholar.10635-750192024-11-13T13:23:07Z Influence of temperature, humidity and defect location on delamination in plastic IC packages Tay, A.A.O. Lin, T.Y. MECHANICAL & PRODUCTION ENGINEERING Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference 179-184 PITEF 2014-06-19T09:10:00Z 2014-06-19T09:10:00Z 1998 Conference Paper Tay, A.A.O.,Lin, T.Y. (1998). Influence of temperature, humidity and defect location on delamination in plastic IC packages. Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference : 179-184. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/75019 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
continent	Asia
country	Singapore Singapore
content_provider	NUS Library
collection	ScholarBank@NUS
description	Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
author2	MECHANICAL & PRODUCTION ENGINEERING
author_facet	MECHANICAL & PRODUCTION ENGINEERING Tay, A.A.O. Lin, T.Y.
format	Conference or Workshop Item
author	Tay, A.A.O. Lin, T.Y.
spellingShingle	Tay, A.A.O. Lin, T.Y. Influence of temperature, humidity and defect location on delamination in plastic IC packages
author_sort	Tay, A.A.O.
title	Influence of temperature, humidity and defect location on delamination in plastic IC packages
title_short	Influence of temperature, humidity and defect location on delamination in plastic IC packages
title_full	Influence of temperature, humidity and defect location on delamination in plastic IC packages
title_fullStr	Influence of temperature, humidity and defect location on delamination in plastic IC packages
title_full_unstemmed	Influence of temperature, humidity and defect location on delamination in plastic IC packages
title_sort	influence of temperature, humidity and defect location on delamination in plastic ic packages
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/75019
_version_	1821226197057536000

Influence of temperature, humidity and defect location on delamination in plastic IC packages

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