Modeling of viscoelastic effects on interfacial delamination in IC packages
Proceedings - Electronic Components and Technology Conference
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2014
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sg-nus-scholar.10635-750412015-01-26T05:47:12Z Modeling of viscoelastic effects on interfacial delamination in IC packages Xiong, Z. Tay, A.A.O. MECHANICAL & PRODUCTION ENGINEERING Proceedings - Electronic Components and Technology Conference 1326-1331 PECCA 2014-06-19T09:10:14Z 2014-06-19T09:10:14Z 2000 Conference Paper Xiong, Z.,Tay, A.A.O. (2000). Modeling of viscoelastic effects on interfacial delamination in IC packages. Proceedings - Electronic Components and Technology Conference : 1326-1331. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/75041 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
Proceedings - Electronic Components and Technology Conference |
| author2 |
MECHANICAL & PRODUCTION ENGINEERING |
| author_facet |
MECHANICAL & PRODUCTION ENGINEERING Xiong, Z. Tay, A.A.O. |
| format |
Conference or Workshop Item |
| author |
Xiong, Z. Tay, A.A.O. |
| spellingShingle |
Xiong, Z. Tay, A.A.O. Modeling of viscoelastic effects on interfacial delamination in IC packages |
| author_sort |
Xiong, Z. |
| title |
Modeling of viscoelastic effects on interfacial delamination in IC packages |
| title_short |
Modeling of viscoelastic effects on interfacial delamination in IC packages |
| title_full |
Modeling of viscoelastic effects on interfacial delamination in IC packages |
| title_fullStr |
Modeling of viscoelastic effects on interfacial delamination in IC packages |
| title_full_unstemmed |
Modeling of viscoelastic effects on interfacial delamination in IC packages |
| title_sort |
modeling of viscoelastic effects on interfacial delamination in ic packages |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/75041 |
| _version_ |
1681088032467320832 |