Moisture diffusion and heat transfer in plastic IC packages
Thermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
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2014
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sg-nus-scholar.10635-750432024-11-13T13:23:08Z Moisture diffusion and heat transfer in plastic IC packages Tay, A.A.O. Lin, T.Y. MECHANICAL & PRODUCTION ENGINEERING Thermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference 67-73 PITEF 2014-06-19T09:10:16Z 2014-06-19T09:10:16Z 1996 Conference Paper Tay, A.A.O.,Lin, T.Y. (1996). Moisture diffusion and heat transfer in plastic IC packages. Thermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference : 67-73. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/75043 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
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NUS Library |
| continent |
Asia |
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Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| description |
Thermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference |
| author2 |
MECHANICAL & PRODUCTION ENGINEERING |
| author_facet |
MECHANICAL & PRODUCTION ENGINEERING Tay, A.A.O. Lin, T.Y. |
| format |
Conference or Workshop Item |
| author |
Tay, A.A.O. Lin, T.Y. |
| spellingShingle |
Tay, A.A.O. Lin, T.Y. Moisture diffusion and heat transfer in plastic IC packages |
| author_sort |
Tay, A.A.O. |
| title |
Moisture diffusion and heat transfer in plastic IC packages |
| title_short |
Moisture diffusion and heat transfer in plastic IC packages |
| title_full |
Moisture diffusion and heat transfer in plastic IC packages |
| title_fullStr |
Moisture diffusion and heat transfer in plastic IC packages |
| title_full_unstemmed |
Moisture diffusion and heat transfer in plastic IC packages |
| title_sort |
moisture diffusion and heat transfer in plastic ic packages |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/75043 |
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1821223639849107456 |